Boxin Electronics will attend the Hong Kong Electronics Fair 2026 at AsiaWorld-Expo, Hong Kong, from October 11 to 14, 2026.
Booth 1E36, Hall 1
Our team will be available at the booth to discuss new headset projects, product requirements, and OEM/ODM manufacturing.
Headsets on Display
The exhibition will cover several of our main product lines, including:
The products are designed for office communication, call centers, remote work, and other business applications. Different connection options and headset configurations can be discussed based on the application and deployment requirements.
Discuss Your Project with Our Team
For customers working on a new headset product, we can discuss the key requirements directly with our sales and engineering teams, including:
Headset structure and industrial design
Speaker and microphone configuration
USB, Bluetooth, QD and other connection options
Noise cancellation and acoustic performance
Tooling and injection molding
PCB and SMT
Assembly and product testing
Packaging and mass production
Boxin Electronics has been manufacturing headsets since 1989. Our production capabilities cover tooling, injection molding, SMT, assembly, testing, and quality control, allowing us to handle different stages of an OEM/ODM project in-house.
Exhibition Details
Event: Hong Kong Electronics Fair 2026
Date: October 11–14, 2026
Venue: AsiaWorld-Expo, Hong Kong
Hall: Hall 1
Booth: 1E36
If you are looking for an office headset manufacturer, UC headset supplier, call center headset manufacturer, or OEM/ODM headset partner, visit us at Booth 1E36, Hall 1.
We look forward to meeting you in Hong Kong.